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KS Rapid Temperature Change Test Chamber
Rapid temperature change chambers are used to test the performance of products under rapid temperature changes and extreme temperatures. They simulate the effects of different climate changes on products to examine failures caused by thermomechanical properties, especially for environmental stress screening (ESS) tests of electronic and electrical products.
Category:
Rapid temperature change test chamber
Keyword:
Kexun
Mobile:18688631772 18925806499
Product Introduction
Product Specifications: Available in standard capacities from 100L to 3400L, with custom options available.
Product Introduction: Rapid temperature change chambers are used to test product performance under rapid temperature fluctuations and extreme temperatures. They simulate the effects of varying climatic conditions on products to examine failures caused by thermomechanical properties, particularly for environmental stress screening (ESS) tests of electronic and electrical products.
Product Alias: Rapid temperature change test chamber, temperature change chamber, temperature cycle chamber, linear rapid temperature change test chamber, non-linear rapid temperature change chamber, stress screening test chamber ESS
Kexun Rapid Temperature Change Test Chamber: Used to detect product performance under rapid temperature changes and extreme temperatures. It is an effective method for identifying and eliminating early failures in circuit boards, electronic components, and other products caused by manufacturing processes or components. Common temperature change rates are 5℃/min, 10℃/min, 15℃/min, 20℃/min, and 25℃/min.
► Meets environmental stress screening (ESS), temperature and humidity testing, temperature cycling testing, high and low temperature storage, and weathering testing reliability requirements;
► Meets temperature setpoint change (linear temperature change) and average (non-linear temperature change) testing requirements;
► Optional liquid nitrogen function, humidity function, and anti-condensation function are available;
► Uses electronic expansion valve technology + innovative control system, product is highly energy efficient >45%;
► Fast temperature change rate, from -55℃⇔+155℃ in 10min (20℃/min);
Application Areas : Semiconductor chips, scientific research institutions, quality inspection, new energy, optoelectronic communication, aerospace and military, automotive industry, LCD display, medical and other technological industries. Special
Standards Met: GB/T 2423.1 Low temperature test method, GJB 150.3 High temperature test, GB/T 2423.2 High temperature test method, GJB 150.4 Low temperature test, GB/T2423.34 Damp heat cycle test method, GJB 150.9 Damp heat test, IEC60068-2 Temperature and humidity test method, MIL-STD-202G-103B Humidity test grid
'Custom specifications and non-standard models available'
Rapid Temperature Change Test Chamber |
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Model |
X: Linear Humidity F: Non-linear Humidity |
KS- Without Humidity (Dry Heat) |
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KS-WB-150L-X/F |
KS-WB-225L-X/F |
KS-WB-512L-X/F |
KS-WB-1000L-X/F |
KS-WB-2400L-X/F |
KS-WB-3400L-X/F |
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KSH- With Humidity (Damp Heat) |
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KSH-WB-150L-X/F |
KSH-WB-225L-X/F |
KSH-WB-512L-X/F |
KSH-WB-1000L-X/F |
KSH-WB-2400L-X/F |
KSH-WB-3400L-X/F |
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Internal Capacity (L) |
150L |
225L |
512L |
1000L |
2400L |
3400L |
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Internal Dimensions (mm) |
Width W |
500 |
600 |
800 |
1000 |
1300 |
1500 |
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Depth D |
500 |
500 |
800 |
1000 |
1400 |
1500 |
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Height H |
600 |
750 |
800 |
1000 |
1300 |
1500 |
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Temperature Change Rate (℃/min) |
5 |
10 |
15 |
20 |
25 |
5 |
10 |
15 |
20 |
25 |
5 |
10 |
15 |
20 |
25 |
5 |
10 |
15 |
20 |
25 |
5 |
10 |
15 |
20 |
25 |
5 |
10 |
15 |
20 |
25 |
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Performance Indicators |
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Temperature Performance Indicators |
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Temperature Range |
-70℃ ~ +180℃ |
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Rapid Temperature Change Range |
A: -40 ~+125℃, C: -55 ~+125℃ |
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Temperature Uniformity |
≤2.0℃ |
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Temperature Fluctuation |
≤+0.5℃ |
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Temperature Deviation |
≤2.0℃ |
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Humidity Performance Indicators |
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Humidity Range |
10%RH~90%RH, (5%~98%RH; custom options available for special conditions) |
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Humidity Uniformity |
≤3.0%RH |
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Humidity Fluctuation |
≤+2.0%RH |
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Humidity Deviation |
+3.0%RH (>75%RH); +5.0%RH (≤75%RH) |
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Cabinet Material |
Inner Chamber |
SUS#304 Stainless Steel |
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Outer Chamber |
Cold-rolled steel plate + double-sided electrostatic spraying |
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Insulation Layer |
Ultra-fine glass wool |
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Viewing Window Size (mm) |
Width W * Height H |
210*300 |
280*350 |
360*510 |
360*510 |
360*510 |
360*510 |
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Noise |
≤75 (dB) |
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Cooling Method |
Water cooling (water temperature 7~28℃, water pressure 0.1~0.4Mpa) |
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Environmental Requirements |
Ambient temperature: 5~35℃, relative humidity ≤85%RH, no strong vibration, electromagnetic radiation shielding, no dust or corrosive substances around |
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Standard Configuration |
One observation window (double-layer hollow tempered conductive glass), one test hole θ50*θ100mm (located on the left), a two-layer sample rack, one box interior photographic lamp (LED light), one water supply tank, one psychrometric band for wet bulb, four small casters, one power cord, and one instruction manual. |
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Power Supply |
AC380V±10%,50Hz±1 three-phase four-wire + ground wire (3/N/PE), ground resistance less than 4Ω |
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Model Description |
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