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HAST high-pressure accelerated aging test chamber (automatic door)
The HAST (Highly Accelerated Stress Test) high-pressure accelerated aging test chamber (with automatic door) simulates the extreme environments and high-temperature, high-humidity operating conditions that a chip may encounter during actual use to verify its reliability and lifespan. Its principle is to place the chip in a high-temperature, high-humidity environment for accelerated aging testing over a period of time, thereby improving product quality and reliability.
Category:
PCT accelerated aging test chamber
Keyword:
Kexun
Mobile:18688631772 18925806499
Product Introduction
Product Introduction: The HAST (Highly Accelerated Stress Test) high-pressure accelerated aging test chamber (with automatic door) simulates the extreme environments and high-temperature, high-humidity operating conditions that chips may encounter in actual use to test the reliability and lifespan of the chips. Its principle is to place the chips in a high-temperature, high-humidity environment for accelerated aging testing over a period of time, thereby improving product quality and reliability.
Product Alias: Automatic door HAST high-pressure accelerated aging test chamber, automatic door HAST aging test chamber, HAST high-accelerated life test chamber, automatic door HAST
Kexun HAST high-pressure accelerated aging test chamber: English name Highly Accelerated Stress Test Chamber. It simulates the high-temperature, high-humidity, high-pressure environment of chips, conducting accelerated aging tests over a certain period to verify the reliability and lifespan of chips in the shortest time, thereby improving product quality and reliability.
► Industry-first pressure test range up to 4KG,
► Automatic door design, button control for door opening and closing, with built-in pressure protection,
► Built-in self-developed PID control algorithm to ensure the accuracy of temperature, humidity, and pressure values,
► Compatible with constant wet heat (HAST) and pressure cooker test (PCT) using unsaturated high-pressure steam,
Common HAST Test Standards
Standard Number |
Implementation Standard |
Temperature (°C) |
Humidity (%R.h) |
Test Conditions |
Time (h) |
IEC60068-2-66 |
Environmental testing Part 2-66: Test methods Cx: Steady-state temperature and humidity |
110±2 |
85±S |
Any voltage |
96/192/408 |
GB/T2423.40 |
Environmental testing of electrotechnical products Part 2: Test methods Cx: Constant wet heat with unsaturated high-pressure steam |
110±2 |
85±S |
1-1000V |
96/192/408 |
GB/T4937.40 |
Semiconductor devices—Mechanical and climatic test methods—Part 4: Damp heat, steady-state, highly accelerated stress test (HAST) |
110±2 |
85±S |
1-1000V |
96/264 |
JIS C0096-2001 |
Environmental testing Part 2: Damp heat—Steady-state (unsaturated pressurized steam) |
110±2 |
85±S |
Any voltage |
96/192/408 |
JEITA(EIAJ)ED- |
Semiconductor device unsaturated steam pressure test |
110±2 |
85±S |
Continuous voltage application |
24/48/96/168/500 |
JPCA-ETO8 |
Printed circuit board unsaturated steam pressure test |
110±2 |
85±S |
Continuous voltage application |
96/192/408 |
AECQ100-Rev-E |
Automotive-grade semiconductor discrete device stress test certification |
110±2 |
85±S |
Continuous voltage application/ |
264/96 |
JESD22-A101C |
Steady-state temperature, humidity/bias, life test (temperature bias life) |
85±2 |
85±S |
Continuous/intermittent application |
24/168/1000 |
JESD22-A102E |
High-pressure steam test (accelerated moisture resistance penetration) |
121±2 |
100±S |
No bias |
24/48/96/168/240/336 |
JESD22-A110E |
HAST high-accelerated temperature stress test |
110±2 |
85±S |
Continuous/intermittent application |
264/96 |
JESD22-A1188 |
Temperature without bias voltage high-accelerated stress test UHAST (unbiased voltage unsaturated high-pressure steam) |
110±2 |
85±S |
No bias |
264/96 |
*Customizable specifications and non-standard models
HAST High-Pressure Accelerated Aging Test Chamber (Automatic Door) |
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Model |
KS-2HAST-31L-A/B |
KS-2HAST-69L-A/B |
KS-2HAST-154L-A/B |
KS-2HAST-248L-A/B |
|
Volume (L) |
31 L |
69 L |
154 L |
248 L |
|
Internal Dimensions |
Diameter φ |
350 |
400 |
550 |
650 |
Depth D |
450 |
550 |
650 |
750 |
|
External Dimensions |
Width W |
700 |
700 |
850 |
950 |
Depth D |
1000 |
1000 |
1150 |
1350 |
|
Height H |
1710 |
1710 |
1760 |
1860 |
|
Performance Indicators |
Temperature Range |
A: +100~+143℃; |
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Humidity Range |
60%~100%RH |
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Pressure Range |
A: 0.2~3kg/cm² (0.018~0.294Mpa); |
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Temperature Uniformity |
≤±2℃ |
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Temperature fluctuation |
≤±0.5℃ |
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Humidity fluctuation |
≤±2 % R.H |
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Humidity deviation |
≤±3 % R.H |
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Temperature deviation |
≤±2℃ |
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Pressure deviation |
≤±2Kpa |
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Heating-up time |
Room temperature~+ 143℃ approximately 45 min;Room temperature~+ 156℃ approximately 55 min |
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Pressurization time |
Normal pressure~3kg/cm² approximately 35 min, external gas source pressurization: approximately 5 min |
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Power |
2.8KW |
3.2KW |
4KW |
5KW |
|
Cabinet material |
Inner box |
SUS #316 stainless steel |
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Outer box |
Cold-rolled steel plate + double-sided electrostatic spraying process |
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Insulation |
Ultra-fine glass wool |
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Noise |
≤60(dB) |
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Controller |
7-inch color touch screen controller (with pressure, temperature and humidity, with RS-485 or RS-232 communication, USB data baking) |
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Resolution |
Temperature: 0.01℃;Humidity: 0.1%RH;Pressure: 0.1 kg/cm²; |
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Pressurization method |
1. Boiler steam pressurization;2. External gas pressurization |
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BIAS bias terminal |
Including bias terminal (please specify when ordering optional) |
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Operating conditions |
Ambient temperature: +5℃~+35℃; Ambient humidity: ≤85%RH;Ambient atmospheric pressure requirement: 86KPa~106KPa |
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Power supply |
AC220V 50/60Hz |
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Protection device |
1. Overtemperature protection, 2. Fan overload protection, 3. Chamber door pressure protection, 4. Water shortage protection, 5. Overflow protection, 6. Heater dry burning protection, |
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Model description |
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