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Rapid temperature change test chamber

The Rapid Temperature Change Test Chamber for Products (Environment Stress Screen Chamber) is suitable for environmental stress screening tests. By subjecting products to environmental stress screening, it accelerates the discovery of design flaws and improves product reliability.

KSH-1000 Rapid Temperature Change Test Chamber

With the continuous development of reliability, enterprises hope to find potential defects in products as quickly as possible, or transition to stability before shipment as quickly as possible, so rapid temperature change tests are being adopted by more and more enterprises. Due to the limitations of mechanical refrigeration, the cooling rate is difficult to achieve faster, so liquid nitrogen (LN2) refrigeration is constantly being used, and the test chamber using liquid nitrogen refrigeration is a high-acceleration rapid temperature change test chamber.

KS-150 Linear Temperature Variation Test Chamber

Used to detect the performance of products under rapid temperature changes and extreme temperatures. Applicable to electronic and electrical products, complete machines and components for rapid temperature change or gradual change adaptability tests, especially for the environmental stress screening (ESS) test of electronic and electrical products.

KSH Rapid Temperature and Humidity Change Test Chamber

Used to detect the performance of products under rapid temperature changes and extreme temperatures. Mainly used in semiconductor chips, scientific research institutions, quality inspection, new energy, optoelectronic communication, aerospace military industry, automotive industry, LCD display, medical and other technology industries.

KS Rapid Temperature Change Test Chamber

Rapid temperature change chambers are used to test the performance of products under rapid temperature changes and extreme temperatures. They simulate the effects of different climate changes on products to examine failures caused by thermomechanical properties, especially for environmental stress screening (ESS) tests of electronic and electrical products.

Two-slot HAST high-pressure accelerated aging chamber

The English name for the two-zone HAST high-pressure accelerated aging chamber (2-Zone HAST CHAMBER) is used to evaluate the reliability of products or materials in humid environments. This is accomplished by setting and creating various conditions of temperature, humidity, and pressure within a highly controlled pressure vessel to evaluate product sealing, moisture absorption, and aging performance.

HAST high-pressure accelerated aging chamber

HAST (Highly Accelerated Stress Test) chamber, also known as HAST chamber in English, is used to evaluate the environmental resistance of electronic components, PCBs, chips, etc., under high temperature, high humidity, and high pressure conditions. By accelerating the failure process, the acceleration factor is between tens and hundreds of times. This type of extreme accelerated simulation reliability test helps determine the limit operating conditions of products or devices, making it easier to discover product failure modes in advance and shorten the life test time of products or systems, thus saving time for mass production verification.

HAST high-pressure accelerated aging test chamber (automatic door)

The HAST (Highly Accelerated Stress Test) high-pressure accelerated aging test chamber (with automatic door) simulates the extreme environments and high-temperature, high-humidity operating conditions that a chip may encounter during actual use to verify its reliability and lifespan. Its principle is to place the chip in a high-temperature, high-humidity environment for accelerated aging testing over a period of time, thereby improving product quality and reliability.

PCT high-pressure accelerated aging box

The PCT high-pressure accelerated aging chamber, also known as the saturated steam high-pressure life test chamber, is called High Pressure Cooking Testing Chamber in English. It is used to evaluate the ability of electronic components, PCBs, chips, etc. to resist the environment under high temperature, high humidity, and high pressure conditions. By accelerating the failure process, it shortens the life test time of products or systems and helps to discover product failure modes in advance.
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